JPH0420243U - - Google Patents

Info

Publication number
JPH0420243U
JPH0420243U JP6031290U JP6031290U JPH0420243U JP H0420243 U JPH0420243 U JP H0420243U JP 6031290 U JP6031290 U JP 6031290U JP 6031290 U JP6031290 U JP 6031290U JP H0420243 U JPH0420243 U JP H0420243U
Authority
JP
Japan
Prior art keywords
sealing resin
package
case body
semiconductor device
injection hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6031290U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087638Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6031290U priority Critical patent/JPH087638Y2/ja
Publication of JPH0420243U publication Critical patent/JPH0420243U/ja
Application granted granted Critical
Publication of JPH087638Y2 publication Critical patent/JPH087638Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6031290U 1990-06-07 1990-06-07 半導体装置のパッケージ Expired - Lifetime JPH087638Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6031290U JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6031290U JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Publications (2)

Publication Number Publication Date
JPH0420243U true JPH0420243U (en]) 1992-02-20
JPH087638Y2 JPH087638Y2 (ja) 1996-03-04

Family

ID=31587568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6031290U Expired - Lifetime JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Country Status (1)

Country Link
JP (1) JPH087638Y2 (en])

Also Published As

Publication number Publication date
JPH087638Y2 (ja) 1996-03-04

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Legal Events

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R250 Receipt of annual fees

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EXPY Cancellation because of completion of term